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PCB-Matrix

Flexible Leiterplatten (Flex PCBs)

Flexible printed circuit boards (FPCs) are highly reliable and extremely flexible, made with polyimide or polyester film as the substrate. They are characterized by high wiring density, light weight, thinness, and good bending properties. FPCs are the only solution to meet the miniaturization and mobility requirements of electronic products. They can be freely bent, rolled, and folded, withstand millions of dynamic bends without damaging the wires, and can be arranged arbitrarily according to spatial layout requirements, moving and stretching freely in three-dimensional space, thereby achieving integration of component assembly and wire connection. FPCs can significantly reduce the size and weight of electronic products, meeting the needs of electronic products as they develop towards higher density, miniaturization, and higher reliability. Therefore, FPCs are widely used in aerospace, military, mobile communications, laptops, computer peripherals, PDAs, digital cameras, and other fields.

Flex – 2L: materials: Shengyi SF-202 & SF305C;  board thickness: 0.3+/-0.05mm; surface treatement: ENIG; Stiffener: PI+FR4

Flex – 2L: Materialien: DuPont FR8520R; Plattendicke: 0,2 /-0,05mm; Oberflächenbehandlung: ENIG

Flexible Leiterplatten (FPCs) sind in erster Linie nach Struktur basierend auf der Anzahl der leitfähigen Schichten und dem Verbindungsverfahren zwischen Substrat und Kupferfolie klassifiziert.

Klassifizierung nach Anzahl der leitfähigen Schichten: FPCs can be classified as single-layer, double-layer, or multi-layer boards. Single-layer boards have only one conductor, a simple structure, and are suitable for low-cost, simple circuits; double-layer boards have two conductors, increasing wiring density, and are suitable for medium-complexity circuits; multi-layer boards achieve multiple conductors through lamination technology and are often used in high-density, high-performance applications, such as power and ground layer designs.

Klassifizierung nach Verbindungsmethode zwischen Substrat und Kupferfolie: FPCs are divided into adhesive-bonded flexible boards and adhesive-free flexible boards. Adhesive-bonded PCBs use adhesive to bond copper foil to a substrate (such as polyimide), resulting in lower cost but slightly less flexibility. Adhesive-free PCBs, on the other hand, are bonded directly via a thermoforming process, offering greater flexibility, bonding strength, and pad flatness, making them suitable for high-reliability applications such as COF packaging.

The demand for flexible PCBs is increasing across all business segments, with especially strong demand from the medical, defense, and industrial markets. UMEC collaborates with several certified factories that meet our technical and order-volume requirements (high-mix, low-batch) to meet the diverse production needs of our customers.

If you need further information or assistance, please get in touch with us, and we will be happy to help.

Unsere technische Fähigkeit für Flex-PCBs

The table below shows some of our basic process capability parameters. If you don’t find the information you need in the table, please get in touch with us, and we will be happy to help you resolve your issue. In addition, other pages also have information about board materials and other types of circuit boards, which can help you make design or production decisions.

Flex PCB Manufacturing Capabilities
- Nein. - Nein. Artikel Standard Fortgeschritten Kommentar
1 Materialien FCCL Klebstoff/Klebstofflos FCCL, PET Klebstoff/Klebstofflos FCCL, PET
2 Stiffener PI, FR4, Stahl, Al-basierter Verstärker PI, FR4, Stahl, Al-basierter Verstärker
3 Klebeblatt Epoxy-Klebstoff-Serie, Acryl-Klebstoff-Serie Epoxy-Klebstoff-Serie, Acryl-Klebstoff-Serie
4 Coverlay Epoxy-Klebstoff-Serie, Acryl-Klebstoff-Serie Epoxy-Klebstoff-Serie, Acryl-Klebstoff-Serie Hauptsächlich Acrylklebstoffserie
5 Grundparameter Ebenen 1‐4L 5-10L
6 Max. Brettgröße 300*500mm 500*2000mm
7 Min. Brettgröße 5 * 10mm (ohne Birge); 10mm * 10mm (mit Brücke) 4 * 8mm (ohne Birge); 8mm * 8mm (mit Brücke)
8 Brettdicke (ohne Versteifer) 0.05‐0.5mm 0.5‐0.8mm
9 Toleranz der einzelnen Schicht ±0.05mm ±0.03mm ohne Steifer
10 Toleranz der Doppelschicht (≤0.3mm) ±0.05mm ±0.03mm ohne Steifer
11 Toleranz der Mehrschicht (<0,3 mm) ±0.05mm ±0.03mm ohne Steifer
12 Toleranz von Mehrschichten (0,3 mm-0,8 mm) ±0.10mm ±10% ohne Steifer
13 Toleranz der Plattendicke (einschließlich PI-Versteifer) ±0.05mm ±10%
14 Toleranz der Plattendicke (einschließlich FR4 Versteifer) ±0.10mm ±10%
15 Bohren Min.Bohrloch (Mech) 0.15mm 0.1mm
16 Min. Bohrloch (Laser) 0.075mm 0.05mm
17 Beenden Lochtoleranz (PTH) ±0.075mm ±0.075mm
18 Endbohrtoleranz (NPTH) ±0.05mm ±0.05mm
19 Min. Distance between via and conductors 6mil (<4 Schicht) 5mil (<4 Schicht)
20 8mil (4 ~ 6 Schicht) 7mil (4 ~ 6 Schicht)
21 12mil (7-8 Schicht) 10mil (7-8 Schicht)
22 Aspektverhältnis (Mech Bohrer) 15:1 18:1
23 Aspektverhältnis (Laserbohrer) 1.2:1 1.2:1
24 Innenschicht Min. Linienbreite/Abstand (12/18um Kupfer) 3.0 / 3.2mil (Schleifenlinien 6.0 / 6.2mil) 2.8/2.7mil (Schleifenlinien 5/5.2mil)
25 Min. Linienbreite/Abstand (35um Kupfer) 4.0/4.0mil (Schleifenlinien 8.0/8.0mil) 3.5/3.5mil (Schleifenlinien 7/7mil)
26 Min. Linienbreite/Abstand (70um Kupfer) 6/6.5mil (Schleifenlinien 10/10.5mil) 5/6mil (Schleifenlinien 9/9.5mil)
27 Max. Kupferdicke 2 Unzen 3 oz
28 Min. Copper thickness 1/3 oz 1/3 oz
29 Außenschicht Min. Linienbreite/Abstand (18um Kupfer) 3/3.2mil (Schleifenlinien 6/6mil) 2,8 / 2,7mil (Schleifenlinien 5,5 / 5,5mil)
30 Min. Linienbreite/Abstand (35um Kupfer) 4/4.5mil (Schleifenlinien 8/8.5mil) 3,5/3,5mil (Schleifenlinien 7,5/7,5mil)
31 Min. Linienbreite/Abstand (70um Kupfer) 6/7mil (Schleifenlinien 10/11mil) 5,5/8,5mil (Schleifenlinien 9,5/10,0mil)
32 Min. Linienbreite/Abstand (105um Kupfer) 10/13mil (Schleifenlinien 12/15mil) 9,5/12,5mil (Schleifenlinien 11,5/14,5mil)
33 Max. Kupferdicke 3 oz 5 Unzen
34 Min. Copper thickness 1/3 oz 1/3 oz
35 Toleranz der Endlinie ±1,5mil ±1mil
36 Prüfmethode Elektrische Prüfung Flugnadeltest, Nadelbetttest Flugnadeltest, Nadelbetttest
37 Oberflächenbehandlung Oberflächenbehandlung HASL, ENIG, ENEPIG, Elektrolytisches Nickelgold, Weichgold, Hartgold, Immersionssilber und OSP Immersion Zinn
38 Mischte Oberflächenbehandlung ENIG OSP, ENIG G/F ENIG OSP, ENIG G/F
39 Routing Routing Toleranz (Laser) ±0.05mm ±0.05mm
40 Routing Toleranz (CNC) ±0.15mm ± 0,1 mm
41 Andere Kontrollierte Impedanz ±10% ±5%