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Matrix de PCB

PCB flexibles (PCB flexibles)

Flexible printed circuit boards (FPCs) are highly reliable and extremely flexible, made with polyimide or polyester film as the substrate. They are characterized by high wiring density, light weight, thinness, and good bending properties. FPCs are the only solution to meet the miniaturization and mobility requirements of electronic products. They can be freely bent, rolled, and folded, withstand millions of dynamic bends without damaging the wires, and can be arranged arbitrarily according to spatial layout requirements, moving and stretching freely in three-dimensional space, thereby achieving integration of component assembly and wire connection. FPCs can significantly reduce the size and weight of electronic products, meeting the needs of electronic products as they develop towards higher density, miniaturization, and higher reliability. Therefore, FPCs are widely used in aerospace, military, mobile communications, laptops, computer peripherals, PDAs, digital cameras, and other fields.

Flex – 2L: materials: Shengyi SF-202 & SF305C;  board thickness: 0.3+/-0.05mm; surface treatement: ENIG; Stiffener: PI+FR4

Flex – 2L: matériaux: DuPont FR8520R; épaisseur de la carte: 0,2 /-0,05mm; traitement de surface: ENIG

Circuits imprimés flexibles (FPC) sont principalement classés par structure en fonction du nombre de couches conductrices et de la méthode de liaison entre le substrat et la feuille de cuivre.

Classification par nombre de couches conductrices : FPCs can be classified as single-layer, double-layer, or multi-layer boards. Single-layer boards have only one conductor, a simple structure, and are suitable for low-cost, simple circuits; double-layer boards have two conductors, increasing wiring density, and are suitable for medium-complexity circuits; multi-layer boards achieve multiple conductors through lamination technology and are often used in high-density, high-performance applications, such as power and ground layer designs.

Classification par méthode de liaison entre le substrat et la feuille de cuivre: FPCs are divided into adhesive-bonded flexible boards and adhesive-free flexible boards. Adhesive-bonded PCBs use adhesive to bond copper foil to a substrate (such as polyimide), resulting in lower cost but slightly less flexibility. Adhesive-free PCBs, on the other hand, are bonded directly via a thermoforming process, offering greater flexibility, bonding strength, and pad flatness, making them suitable for high-reliability applications such as COF packaging.

The demand for flexible PCBs is increasing across all business segments, with especially strong demand from the medical, defense, and industrial markets. UMEC collaborates with several certified factories that meet our technical and order-volume requirements (high-mix, low-batch) to meet the diverse production needs of our customers.

If you need further information or assistance, please get in touch with us, and we will be happy to help.

Notre capacité technique pour les PCB flexibles

The table below shows some of our basic process capability parameters. If you don’t find the information you need in the table, please get in touch with us, and we will be happy to help you resolve your issue. In addition, other pages also have information about board materials and other types of circuit boards, which can help you make design or production decisions.

Flex PCB Manufacturing Capabilities
- Non, non. Article Standard Avancée Commentaire
1 Matériaux FCCL FCCL adhésif/sans adhésif, PET FCCL adhésif/sans adhésif, PET
2 Stiffener PI, FR4, Acier, Fertisseur à base d'Al PI, FR4, Acier, Fertisseur à base d'Al
3 Feuille adhésive Série adhésive époxy, série adhésive acrylique Série adhésive époxy, série adhésive acrylique
4 couverture Série adhésive époxy, série adhésive acrylique Série adhésive époxy, série adhésive acrylique Série d'adhésifs principalement acryliques
5 Paramètres de base Couches 1‐4L 5-10L
6 Taille maximale de la planche 300*500mm 500*2000mm
7 Taille minimale du tableau 5 * 10mm (sans birdge); 10mm*10mm (avec pont) 4 * 8mm (sans birdge); 8mm*8mm (avec pont)
8 Épaisseur du tableau (sans raidisseur) 0.05‐0.5mm 0.5‐0.8mm
9 Tolérance de couche unique ±0.05mm ±0.03mm sans raidisseur
10 Tolérance de double couche (≤0.3mm) ±0.05mm ±0.03mm sans raidisseur
11 Tolérance de multi-couche (<0,3 mm) ±0.05mm ±0.03mm sans raidisseur
12 Tolérance de multi-couche (0.3mm-0.8mm) ±0.10mm ± 10% sans raidisseur
13 Tolérance de l'épaisseur de la carte (y compris le raidisseur PI) ±0.05mm ± 10%
14 Tolérance de l'épaisseur de la planche (y compris le raidisseur FR4) ±0.10mm ± 10%
15 Perforage Min.Drilling trou (mech) 0.15mm 0.1mm
16 Min.Drilling trou (laser) 0.075mm 0.05mm
17 Tolérance de trou de finition (PTH) ±0.075mm ±0.075mm
18 Tolérance de trou de finition (NPTH) ±0.05mm ±0.05mm
19 Min. Distance between via and conductors 6mil (<4 couche) 5 ml (<4 couches)
20 8mil (couche 4~6) 7mil (couche 4~6)
21 12mil (couche 7-8) 10mil (couche 7-8)
22 Rapport d'aspect (forage mech) 15:1 18:1
23 Rapport d'aspect (forage laser) 1.2:1 1.2:1
24 Couche intérieure Largeur/espacement de ligne min. (cuivre 12/18um) 3.0/3.2mil (lignes de boucle 6.0/6.2mil) 2.8/2.7mil (lignes de boucle 5/5.2mil)
25 Largeur/espacement de ligne min. (cuivre 35um) 4.0/4.0mil (lignes de boucle 8.0/8.0mil) 3.5/3.5mil (lignes de boucle 7/7mil)
26 Largeur/espacement de ligne min. (cuivre 70um) 6/6.5mil (lignes de boucle 10/10.5mil) 5/6mil (lignes de boucle 9/9.5mil)
27 Épaisseur Max.Copper 2 oz 3 oz
28 Min. Copper thickness 1/3 oz 1/3 oz
29 Couche extérieure Largeur/espacement de ligne min. (cuivre 18um) 3/3.2mil (lignes de boucle 6/6mil) 2.8/2.7mil (lignes de boucle 5.5/5.5mil)
30 Largeur/espacement de ligne min. (cuivre 35um) 4/4.5mil (lignes de boucle 8/8.5mil) 3.5/3.5mil (lignes de boucle 7.5/7.5mil)
31 Largeur/espacement de ligne min. (cuivre 70um) 6/7mil (lignes de boucle 10/11mil) 5.5/8.5mil (lignes de boucle 9.5/10.0mil)
32 Largeur/espacement de ligne min. (cuivre 105um) 10/13mil (lignes de boucle 12/15mil) 9.5/12.5mil (lignes de boucle 11.5/14.5mil)
33 Épaisseur Max.Copper 3 oz 5 oz
34 Min. Copper thickness 1/3 oz 1/3 oz
35 Tolérance de ligne de finition ±1,5 millimètres ±1mil
36 Méthode d'essai Essais électriques Essai d'aiguille volante, essai de lit d'aiguille Essai d'aiguille volante, essai de lit d'aiguille
37 Traitement de surface Traitement de surface HASL, ENIG, ENEPIG, Or nickel électrolytique, Or doux, Or dur, Argent immersion et OSP Étin d'immersion
38 Traitement de surface mixte ENIG OSP, ENIG G/F ENIG OSP, ENIG G/F
39 Routage Tolérance de routage (laser) ±0.05mm ±0.05mm
40 Tolérance de routage (CNC) ±0.15mm ± 0,1 mm
41 Autres Impédance contrôlée ± 10% ± 5%