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PCB-Matrix

Mehrschichtplatten

Multilayer circuit boards are composite boards with three or more conductive layers. Each layer is isolated by an insulating dielectric layer and electrically connected by plated through-holes. The outer layer is a double-sided trace layer, while the inner conductive layers are integrated within an insulating board. Single- or double-layer circuit boards are stacked using optical positioning and layer-by-layer lamination to form a multilayer substrate. The stacked structure is crucial; the thickness of each dielectric layer directly affects the circuit impedance characteristics, signal integrity, and heat dissipation performance.

Multilayer PCB – 8L: materials: FR4 (SY1000-2M); inner/outer layer line width and space:3mil/3mil; inner layer line to hole space: 6mil; hole tolerance: +/-2mil; BGA size: 10mil; surface treatment: ENIG; features: high density, small line and space, dense BGA designing

 

Multilayer PCB – 16L: materials: IT180A; inner/outer layer line width and space: 2.5mil/2.5mil; inner layer line to hole space: 6mil; hole tolerance: +/-2mil; surface treatment: ENIG; BGA size: 10mil; features: high density, small line and space, dense BGA designing

Mehrschichtplattenals eine Art von Leiterplatte, werden in erster Linie basierend auf Materialeigenschaften eingestuft:

Multilayer circuit boards can be classified into standard and special types based on the substrate’s mechanical and electrical properties.

Standardtypen mainly use an FR-4 epoxy glass cloth substrate, which has good mechanical strength and general electrical properties, making it suitable for most general electronic devices.

Sondertypen umfassen Hochfrequenzplatten (wie solche, die Polytetrafluorethylen verwenden, geeignet für Funkfrequenz- und Mikrowellenkommunikation), Metallsubstrate (wie Aluminiumsubstrate, die eine ausgezeichnete Wärmeabfuhr aufweisen und in leistungsstarken Stromversorgungen verwendet werden) und Keramiksubstrate (die eine hohe Wärmebeständigkeit und Stabilität aufweisen, geeignet für Hochtemperaturumgebungen) usw.

Many products use multilayer PCBs, including computers, medical equipment, in-car systems, GPS and satellite systems, and industrial control systems. It is the core carrier of modern high-end, complex electronic devices.

The multilayer PCB segment is a big part of our production. Our company specializes in producing high-quality multilayer PCBs using state-of-the-art equipment and technology. We can produce multilayer PCBs with high layer counts, ensuring stability, reliability, and optimal electrical performance. Whether it’s for complex industrial control systems, medical devices, or automotive applications, our manufacturing processes meet the highest industry standards, providing robust solutions for demanding projects.

If you need further information or assistance, please get in touch with us, and we will be happy to help.

Unsere technische Fähigkeit für mehrlagige Leiterplatten

The table below shows some of our basic process capability parameters. If you don’t find the information you need in the table, please get in touch with us, and we will be happy to help you resolve your issue. In addition, other pages also have information about board materials and other types of circuit boards, which can help you make design or production decisions.

Multilayer PCB Manufacturing Capabilities
- Nein. - Nein. Artikel Standard Fortgeschritten
1 Materialien Materialien FR-4 Mittel, hohe Tg, halogenfrei, hohe CTI, hohe Geschwindigkeit FR-4 Mittel, hohe Tg, halogenfrei, hohe CTI, hohe Geschwindigkeit
2 Grundparameter Ebenen 4-42L 44-64L
3 Max.Board Größe 1100*660mm 1400*800mm
4 Min. Board size 5 * 5 mm 3 * 3 mm
5 Max.Board Dicke 6 mm 12 mm
6 Min. Board thickness 0.3mm 0.2mm
7 Toleranz der Plattendicke(＞1,0 mm) ±10% ±10%
8 Toleranz der Plattendicke (≤1.0mm) ± 0,1 mm ± 0,1 mm
9 Bohren Min.Bohrloch (Mech) 0.2mm 0.15mm
10 Min. Bohrloch (Laser) 0.1mm 0.075mm
11 Beenden Lochtoleranz (PTH) ±0.075mm ±0.075mm
12 Endbohrtoleranz (NPTH) ±0.05mm ±0.05mm
13 Abweichung der Lochposition ±0.075mm ±0.05mm
14 Min. Distance between via and conductors 0.2mm 0.12mm
15 Min. Drilling spacing between holes(the same network) 0.2mm 0.15mm
16 Min. Drilling spacing between holes(for different networks) 0.3mm 0.2mm
17 Aspektverhältnis (Mech Bohrer) 10:1 20:1
18 Innenschicht Min. Line width/space 4/4mil 2/2mil
19 Max. Kupferdicke 10oz 12 oz
20 Min. Copper thickness 0.5oz 0.3oz
21 Außenschicht Min. Line width/space 4/4mil 2.5/2.5mil
22 Max. Kupferdicke 10oz 12 oz
23 Min. Copper thickness 0.5oz 0.5oz
24 Min. BGA pad size 12mil (8mil für elektrische weiche Goldplatte) 10mil (7mil für elektrische weiche Goldplatte)
25 Toleranz der Endlinie ±1,5mil ±1mil
26 Prüfmethode Elektrische Prüfung Flugnadeltest, Nadelbetttest Flugnadeltest, Nadelbetttest
27 Oberflächenbehandlung Oberflächenbehandlung HASL/LF HASL, ENIG, ENEPIG, Immersion Silver, Immersion Zinn, Plating Zinn, Plating Silver, Electrolytic Nickel Gold, Soft Gold, Hard Gold, Gold Finger, OSP, Carbon Tinte. HASL/LF HASL, ENIG, ENEPIG, Immersion Silver, Immersion Zinn, Plating Zinn, Plating Silver, Electrolytic Nickel Gold, Soft Gold, Hard Gold, Gold Finger, OSP, Carbon Tinte.
28 Mischte Oberflächenbehandlung GF OSP, GF HASL, OSP ENIG, IAG GF, Isn GF GF OSP, GF HASL, OSP ENIG, IAG GF, Isn GF
29 Routing Routing Toleranz (Laser) ±0.05mm ±0.05mm
30 Routing Toleranz (CNC) ±0.15mm ± 0,1 mm
31 Andere Via Behandlungsmethode Durch Lochfensteröffnung, durch Lochdecköl, durch Lochsteckenöl, durch Lochsteckenharz/Kupferpaste Durch Lochfensteröffnung, durch Lochdecköl, durch Lochsteckenöl, durch Lochsteckenharz/Kupferpaste
32 Warp und Twist ≤0.7% ≤0.5%
33 Kontrollierte Impedanz ±10% ±5%
34 Sonderprozess Goldene Finger, Halblöcher, Metallkanten, Stufennuten usw. Goldene Finger, Halblöcher, Metallkanten, Stufennuten usw.