We are proud to say that our partner has China’s largest design center, with over 800 experienced engineers providing efficient design services to clients worldwide. They collaborate closely with major integrated circuit companies, drawing on over 20 years of industry design experience. In the face of ever-changing markets and new customer requirements, rapid response and adaptation are essential capabilities.
Integrierte Entwicklung auf Board-Ebene für Android, Linux, WinCE, Ubuntu, Debian, BSP.
SDRAM, DDR2, DDR3, LPDDR3, DDR4, LPDDR4, eMMC, NAND FLASH, SPI FLASH, QSPI FLASH, EEPROM, SRAM, SSD, Festplatte, USB-Flash-Laufwerk.
UART, I2C, SPI, CAN, LIN, Ethernet, USB 2.0, USB 3.0, Typ-C, SDIO, PCI Express (PCIe), SATA, SerDes, drahtlose Kommunikation, Peripheriebus
HDMI, DVI, VGA, LVDS, MIPI, DSI, DisplayPort (DP), CVBS, EDP, SDI, kapazitive Berührung und resistive Berührung.
NXP, Rockchip, Allwinner, Texas Instruments
Xilinx, Nvidia, Intel, Horizon Robotics
