PCB RF - Radio - Frequency PCB

Radio frequency (RF) microwave circuit boards are printed circuit boards specifically designed to process high-frequency signals (typically in the 300 MHz to 300 GHz range). They play a crucial role in high-frequency applications such as wireless communication, radar systems, and satellite equipment, enabling low-loss, high-fidelity signal transmission. The core characteristic of RF microwave circuit boards is their high-frequency adaptability, which requires strict control of signal integrity. Key design parameters include low insertion loss, precise impedance control, a stable dielectric constant, and a low dielectric loss tangent. These characteristics are achieved through optimized substrate selection (such as PTFE or ceramic filler materials), wiring structure, and shielding design to address high-frequency effects such as skin effect and parasitic parameters.

UMEC works closely with your product design team, providing information on material options, relative costs, and DFM considerations to ensure projects achieve their benefit objectives.

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Nossa capacidade técnica para PCB RF

The table below shows some of our basic process capability parameters. If you don’t find the information you need in the table, please get in touch with us, and we will be happy to help you resolve your issue. In addition, other pages also have information about board materials and other types of circuit boards, which can help you make design or production decisions.

RF PCB Manufacturing Capabilities
Não. Elemento Normal Avançado
1 Materiales Materiales F4B/Rogers/Taconic/Arlon/Panasonic F4B/Rogers/Taconic/Arlon/Panasonic
2 Parâmetros básicos Capas 1-42L 44-64L
3 Tamanho máximo do taboleiro 500*500mm 1200*600mm
4 Min. Board size 5*5mm 3*3mm
5 Espessura máxima do painel 6mm 12mm
6 Min. Board thickness 0.3mm 0.2mm
7 Tolerância da espessura de bordo (>1,0mm) ±10% ±10%
8 Tolerância da espessura de bordo (≤1,0 mm) ±0,1 mm ±0,1 mm
9 Forragem Buraco mínimo de foragem 0.2mm 0.15mm
10 Buried hole(mech) 0.3mm 0.2mm
11 Tolerança ao buraco final (PTH) ±0.075mm ±0.075mm
12 Tolerança ao buraco final (NPTH) ±0.05mm ±0.05mm
13 Desvio da posição do buraco ±0.075mm ±0.075mm
14 Min. Distance between via and conductors 0.2mm 0.12mm
15 Min. Drilling spacing between holes(the same network) 0.2mm 0.15mm
16 Min. Drilling spacing between holes(for different networks) 0.3mm 0.2mm
17 Proporcão de aspecto (exercício mech) 10:1 20:1
18 Capa interior Min. Line width/space 4/4 milhões 3/3 milhões
19 Espessura máxima de cobre 2oz 3oz
20 Min. Copper thickness 0.5oz 0.3oz
21 Capa externa Min. Line width/space 4/4 milhões 3/3 milhões
22 Espessura máxima de cobre 2oz 3oz
23 Min. Copper thickness 0.5oz 0.3oz
24 Min. BGA pad size 12 milhões (8 milhões para placa de ouro suave elétrica) 10 milhões (7 milhões para placa de ouro suave elétrica)
25 Rematar a tolerância da linha ±1,5 milhões ±1 milhões
26 Método de teste Testes elétricos Teste de agulha voadora, teste de cama de agulha Teste de agulha voadora, teste de cama de agulha
27 Tratamento de superfície Tratamento de superfície HASL/LF HASL, ENIG, ENEPIG, Immersion Silver, Immersion Tin, Plating Tin, Plating Silver, Electrolytic Nickel Gold, Soft Gold, Hard Gold, Gold Finger, OSP, Carbon Ink. HASL/LF HASL, ENIG, ENEPIG, Immersion Silver, Immersion Tin, Plating Tin, Plating Silver, Electrolytic Nickel Gold, Soft Gold, Hard Gold, Gold Finger, OSP, Carbon Ink.
28 Tratamento misto de superfície GF OSP, GF HASL, OSP ENIG, IAG GF, Isn GF GF OSP, GF HASL, OSP ENIG, IAG GF, Isn GF
29 Routing Tolerança de Routing (Laser) ±0.05mm ±0.05mm
30 Tolerância de Routing (CNC) ±0.15mm ±0,1 mm
31 Outros Via método de tratamento através da abertura da janela do buraco, através do óleo de cobertura do buraco, através do óleo de cobertura do buraco, através da resina/pasta de cobre do buraco através da abertura da janela do buraco, através do óleo de cobertura do buraco, através do óleo de cobertura do buraco, através da resina/pasta de cobre do buraco
32 Warp e Twist ≤0.7% ≤0.5%
33 Impedança Controlada ±10% ±5%
34 Processo especial Dedos de ouro, meios buracos, bordos metal úrgicos, cavos passos, etc. Dedos de ouro, meios buracos, bordos metal úrgicos, cavos passos, etc.