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PCB MATRIX

PCB multicamadas

Multilayer circuit boards are composite boards with three or more conductive layers. Each layer is isolated by an insulating dielectric layer and electrically connected by plated through-holes. The outer layer is a double-sided trace layer, while the inner conductive layers are integrated within an insulating board. Single- or double-layer circuit boards are stacked using optical positioning and layer-by-layer lamination to form a multilayer substrate. The stacked structure is crucial; the thickness of each dielectric layer directly affects the circuit impedance characteristics, signal integrity, and heat dissipation performance.

Multilayer PCB – 8L: materials: FR4 (SY1000-2M); inner/outer layer line width and space:3mil/3mil; inner layer line to hole space: 6mil; hole tolerance: +/-2mil; BGA size: 10mil; surface treatment: ENIG; features: high density, small line and space, dense BGA designing

 

Multilayer PCB – 16L: materials: IT180A; inner/outer layer line width and space: 2.5mil/2.5mil; inner layer line to hole space: 6mil; hole tolerance: +/-2mil; surface treatment: ENIG; BGA size: 10mil; features: high density, small line and space, dense BGA designing

Taboleiras de circuitos multicamadascomo um tipo de placa de circuitos impressos, são principalmente classificados com base em propriedades materiais:

Multilayer circuit boards can be classified into standard and special types based on the substrate’s mechanical and electrical properties.

Tipos padrões mainly use an FR-4 epoxy glass cloth substrate, which has good mechanical strength and general electrical properties, making it suitable for most general electronic devices.

Tipos especiais incluim placas de alta frequência (como aquelas que utilizam politetrafluoroetileno, adequadas para frequência de rádio e comunicações de microondas), substratos de metal (como substratos de alumínio, que têm excelente dissipação de calor e são utilizados em suprimentos de alta potência), e substratos de cerâmica (que têm alta resistência ao calor e estabilidade, adequados para ambientes de alta temperatura), etc.

Many products use multilayer PCBs, including computers, medical equipment, in-car systems, GPS and satellite systems, and industrial control systems. It is the core carrier of modern high-end, complex electronic devices.

The multilayer PCB segment is a big part of our production. Our company specializes in producing high-quality multilayer PCBs using state-of-the-art equipment and technology. We can produce multilayer PCBs with high layer counts, ensuring stability, reliability, and optimal electrical performance. Whether it’s for complex industrial control systems, medical devices, or automotive applications, our manufacturing processes meet the highest industry standards, providing robust solutions for demanding projects.

If you need further information or assistance, please get in touch with us, and we will be happy to help.

Nossa capacidade técnica para PCB multicamadas

The table below shows some of our basic process capability parameters. If you don’t find the information you need in the table, please get in touch with us, and we will be happy to help you resolve your issue. In addition, other pages also have information about board materials and other types of circuit boards, which can help you make design or production decisions.

Multilayer PCB Manufacturing Capabilities
Não. Elemento Normal Avançado
1 Materiales Materiales FR-4 médio, alta Tg, livre de halogênio, alta CTI, alta velocidade FR-4 médio, alta Tg, livre de halogênio, alta CTI, alta velocidade
2 Parâmetros básicos Capas 4-42L 44-64L
3 Tamanho máximo do taboleiro 1100*660mm 1400*800mm
4 Min. Board size 5*5mm 3*3mm
5 Espessura máxima do painel 6mm 12mm
6 Min. Board thickness 0.3mm 0.2mm
7 Tolerância da espessura do painel(＞1,0mm) ±10% ±10%
8 Tolerância da espessura de bordo (≤1,0 mm) ±0,1 mm ±0,1 mm
9 Forragem Buraco mínimo de foragem 0.2mm 0.15mm
10 Buraco mínimo de perfuração (laser) 0.1mm 0.075mm
11 Tolerança ao buraco final (PTH) ±0.075mm ±0.075mm
12 Tolerança ao buraco final (NPTH) ±0.05mm ±0.05mm
13 Desvio da posição do buraco ±0.075mm ±0.05mm
14 Min. Distance between via and conductors 0.2mm 0.12mm
15 Min. Drilling spacing between holes(the same network) 0.2mm 0.15mm
16 Min. Drilling spacing between holes(for different networks) 0.3mm 0.2mm
17 Proporcão de aspecto (exercício mech) 10:1 20:1
18 Capa interior Min. Line width/space 4/4 milhões 2/2 milhões
19 Espessura máxima de cobre 10oz 12oz
20 Min. Copper thickness 0.5oz 0.3oz
21 Capa externa Min. Line width/space 4/4 milhões 2.5/2.5mil
22 Espessura máxima de cobre 10oz 12oz
23 Min. Copper thickness 0.5oz 0.5oz
24 Min. BGA pad size 12 milhões (8 milhões para placa de ouro suave elétrica) 10 milhões (7 milhões para placa de ouro suave elétrica)
25 Rematar a tolerância da linha ±1,5 milhões ±1 milhões
26 Método de teste Testes elétricos Teste de agulha voadora, teste de cama de agulha Teste de agulha voadora, teste de cama de agulha
27 Tratamento de superfície Tratamento de superfície HASL/LF HASL, ENIG, ENEPIG, Immersion Silver, Immersion Tin, Plating Tin, Plating Silver, Electrolytic Nickel Gold, Soft Gold, Hard Gold, Gold Finger, OSP, Carbon Ink. HASL/LF HASL, ENIG, ENEPIG, Immersion Silver, Immersion Tin, Plating Tin, Plating Silver, Electrolytic Nickel Gold, Soft Gold, Hard Gold, Gold Finger, OSP, Carbon Ink.
28 Tratamento misto de superfície GF OSP, GF HASL, OSP ENIG, IAG GF, Isn GF GF OSP, GF HASL, OSP ENIG, IAG GF, Isn GF
29 Routing Tolerança de Routing (Laser) ±0.05mm ±0.05mm
30 Tolerância de Routing (CNC) ±0.15mm ±0,1 mm
31 Outros Via método de tratamento através da abertura da janela do buraco, através do óleo de cobertura do buraco, através do óleo de cobertura do buraco, através da resina/pasta de cobre do buraco através da abertura da janela do buraco, através do óleo de cobertura do buraco, através do óleo de cobertura do buraco, através da resina/pasta de cobre do buraco
32 Warp e Twist ≤0.7% ≤0.5%
33 Impedança Controlada ±10% ±5%
34 Processo especial Dedos de ouro, meios buracos, bordos metal úrgicos, cavos passos, etc. Dedos de ouro, meios buracos, bordos metal úrgicos, cavos passos, etc.