PCB RF – PCB a radiofrequenza

Radio frequency (RF) microwave circuit boards are printed circuit boards specifically designed to process high-frequency signals (typically in the 300 MHz to 300 GHz range). They play a crucial role in high-frequency applications such as wireless communication, radar systems, and satellite equipment, enabling low-loss, high-fidelity signal transmission. The core characteristic of RF microwave circuit boards is their high-frequency adaptability, which requires strict control of signal integrity. Key design parameters include low insertion loss, precise impedance control, a stable dielectric constant, and a low dielectric loss tangent. These characteristics are achieved through optimized substrate selection (such as PTFE or ceramic filler materials), wiring structure, and shielding design to address high-frequency effects such as skin effect and parasitic parameters.

UMEC works closely with your product design team, providing information on material options, relative costs, and DFM considerations to ensure projects achieve their benefit objectives.

If you need further information or assistance, please get in touch with us, and we will be happy to help.

La nostra capacità tecnica per i PCB RF

The table below shows some of our basic process capability parameters. If you don’t find the information you need in the table, please get in touch with us, and we will be happy to help you resolve your issue. In addition, other pages also have information about board materials and other types of circuit boards, which can help you make design or production decisions.

RF PCB Manufacturing Capabilities
- No, no, no. Articolo Standard Avanzato
1 Materiali Materiali F4B/Rogers/Taconic/Arlon/Panasonic F4B/Rogers/Taconic/Arlon/Panasonic
2 Parametri di base Livelli 1-42L 44-64L
3 Dimensione Max.Board 500*500mm 1200*600mm
4 Min. Board size 5 * 5mm 3 * 3 mm
5 Spessore Max.Board 6 millimetri 12 millimetri
6 Min. Board thickness 0.3mm 0.2mm
7 Tolleranza dello spessore della scheda (> 1.0mm) ±10% ±10%
8 Tolleranza dello spessore della scheda (≤1.0mm) ± 0,1 mm ± 0,1 mm
9 Foratura Min.Drilling foro (mech) 0.2mm 0.15mm
10 Min.Buried foro (mech) 0.3mm 0.2mm
11 Finire la tolleranza del foro (PTH) ±0.075mm ±0.075mm
12 Finire la tolleranza del foro (NPTH) ±0.05mm ±0.05mm
13 Deviazione della posizione del foro ±0.075mm ±0.075mm
14 Min. Distance between via and conductors 0.2mm 0.12mm
15 Min. Drilling spacing between holes(the same network) 0.2mm 0.15mm
16 Min. Drilling spacing between holes(for different networks) 0.3mm 0.2mm
17 Rapporto di aspetto (mech drill) 10:1 20:1
18 Strato interno Min. Line width/space 4/4 mili 3/3mil
19 Spessore Max.Copper 2 oz 3 oz
20 Min. Copper thickness 0.5oz 0.3oz
21 Strato esterno Min. Line width/space 4/4 mili 3/3mil
22 Spessore Max.Copper 2 oz 3 oz
23 Min. Copper thickness 0.5oz 0.3oz
24 Min. BGA pad size 12mil (8mil per la scheda elettrica dell'oro morbido) 10mil (7mil per la scheda elettrica dell'oro morbido)
25 Tolleranza della linea di finitura ±1.5mil ±1mil
26 Metodo di prova Prova elettrica Prova dell'ago volante, prova del letto dell'ago Prova dell'ago volante, prova del letto dell'ago
27 Trattamento superficiale Trattamento superficiale HASL/LF HASL, ENIG, ENEPIG, Immersion Silver, Immersion Stain, Plating Stain, Plating Silver, Electrolytic Nickel Gold, Soft Gold, Hard Gold, Gold Finger, OSP, Carbon Ink. HASL/LF HASL, ENIG, ENEPIG, Immersion Silver, Immersion Stain, Plating Stain, Plating Silver, Electrolytic Nickel Gold, Soft Gold, Hard Gold, Gold Finger, OSP, Carbon Ink.
28 Trattamento superficiale misto GF OSP, GF HASL, OSP ENIG, IAG GF, Isn GF GF OSP, GF HASL, OSP ENIG, IAG GF, Isn GF
29 Routing Tolleranza di routing (laser) ±0.05mm ±0.05mm
30 Tolleranza di routing (CNC) ±0.15mm ± 0,1 mm
31 Altri Metodo di trattamento Attraverso l'apertura della finestra del foro, attraverso l'olio del coperchio del foro, attraverso l'olio del tappo del foro, attraverso la resina del tappo del foro / pasta di rame Attraverso l'apertura della finestra del foro, attraverso l'olio del coperchio del foro, attraverso l'olio del tappo del foro, attraverso la resina del tappo del foro / pasta di rame
32 Warp e Twist ≤0.7% ≤0.5%
33 Impedanza controllata ±10% ±5%
34 Processo speciale Dite d'oro, mezzi fori, bordi in metallo, scanalature a gradini, ecc. Dite d'oro, mezzi fori, bordi in metallo, scanalature a gradini, ecc.