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PCB MATRIX

PCB multistrato

Multilayer circuit boards are composite boards with three or more conductive layers. Each layer is isolated by an insulating dielectric layer and electrically connected by plated through-holes. The outer layer is a double-sided trace layer, while the inner conductive layers are integrated within an insulating board. Single- or double-layer circuit boards are stacked using optical positioning and layer-by-layer lamination to form a multilayer substrate. The stacked structure is crucial; the thickness of each dielectric layer directly affects the circuit impedance characteristics, signal integrity, and heat dissipation performance.

Multilayer PCB – 8L: materials: FR4 (SY1000-2M); inner/outer layer line width and space:3mil/3mil; inner layer line to hole space: 6mil; hole tolerance: +/-2mil; BGA size: 10mil; surface treatment: ENIG; features: high density, small line and space, dense BGA designing

 

Multilayer PCB – 16L: materials: IT180A; inner/outer layer line width and space: 2.5mil/2.5mil; inner layer line to hole space: 6mil; hole tolerance: +/-2mil; surface treatment: ENIG; BGA size: 10mil; features: high density, small line and space, dense BGA designing

Schede a circuiti multistratocome un tipo di scheda a circuito stampato, sono classificati principalmente in base alle proprietà del materiale:

Multilayer circuit boards can be classified into standard and special types based on the substrate’s mechanical and electrical properties.

Tipi standard mainly use an FR-4 epoxy glass cloth substrate, which has good mechanical strength and general electrical properties, making it suitable for most general electronic devices.

Tipi speciali includono schede ad alta frequenza (come quelle che utilizzano politetrafluoroetilene, adatte per le comunicazioni a radiofrequenza e a microonde), substrati metallici (come substrati in alluminio, che hanno un'eccellente dissipazione del calore e sono utilizzati in alimentazioni ad alta potenza) e substrati ceramici (che hanno alta resistenza al calore e stabilità, adatti per ambienti ad alte temperature), ecc.

Many products use multilayer PCBs, including computers, medical equipment, in-car systems, GPS and satellite systems, and industrial control systems. It is the core carrier of modern high-end, complex electronic devices.

The multilayer PCB segment is a big part of our production. Our company specializes in producing high-quality multilayer PCBs using state-of-the-art equipment and technology. We can produce multilayer PCBs with high layer counts, ensuring stability, reliability, and optimal electrical performance. Whether it’s for complex industrial control systems, medical devices, or automotive applications, our manufacturing processes meet the highest industry standards, providing robust solutions for demanding projects.

If you need further information or assistance, please get in touch with us, and we will be happy to help.

La nostra capacità tecnica per PCB multistrato

The table below shows some of our basic process capability parameters. If you don’t find the information you need in the table, please get in touch with us, and we will be happy to help you resolve your issue. In addition, other pages also have information about board materials and other types of circuit boards, which can help you make design or production decisions.

Multilayer PCB Manufacturing Capabilities
- No, no, no. Articolo Standard Avanzato
1 Materiali Materiali FR-4 Medio, Alta Tg, Senza Alogeni, Alta CTI, Alta Velocità FR-4 Medio, Alta Tg, Senza Alogeni, Alta CTI, Alta Velocità
2 Parametri di base Livelli 4-42L 44-64L
3 Dimensione Max.Board 1100*660mm 1400*800mm
4 Min. Board size 5 * 5mm 3 * 3 mm
5 Spessore Max.Board 6 millimetri 12 millimetri
6 Min. Board thickness 0.3mm 0.2mm
7 Tolleranza dello spessore della scheda (＞1,0 mm) ±10% ±10%
8 Tolleranza dello spessore della scheda (≤1.0mm) ± 0,1 mm ± 0,1 mm
9 Foratura Min.Drilling foro (mech) 0.2mm 0.15mm
10 Min. Foro di perforazione (laser) 0.1mm 0.075mm
11 Finire la tolleranza del foro (PTH) ±0.075mm ±0.075mm
12 Finire la tolleranza del foro (NPTH) ±0.05mm ±0.05mm
13 Deviazione della posizione del foro ±0.075mm ±0.05mm
14 Min. Distance between via and conductors 0.2mm 0.12mm
15 Min. Drilling spacing between holes(the same network) 0.2mm 0.15mm
16 Min. Drilling spacing between holes(for different networks) 0.3mm 0.2mm
17 Rapporto di aspetto (mech drill) 10:1 20:1
18 Strato interno Min. Line width/space 4/4 mili 2/2mil
19 Spessore Max.Copper 10oz 12 oz
20 Min. Copper thickness 0.5oz 0.3oz
21 Strato esterno Min. Line width/space 4/4 mili 2.5/2.5mil
22 Spessore Max.Copper 10oz 12 oz
23 Min. Copper thickness 0.5oz 0.5oz
24 Min. BGA pad size 12mil (8mil per la scheda elettrica dell'oro morbido) 10mil (7mil per la scheda elettrica dell'oro morbido)
25 Tolleranza della linea di finitura ±1.5mil ±1mil
26 Metodo di prova Prova elettrica Prova dell'ago volante, prova del letto dell'ago Prova dell'ago volante, prova del letto dell'ago
27 Trattamento superficiale Trattamento superficiale HASL/LF HASL, ENIG, ENEPIG, Immersion Silver, Immersion Stain, Plating Stain, Plating Silver, Electrolytic Nickel Gold, Soft Gold, Hard Gold, Gold Finger, OSP, Carbon Ink. HASL/LF HASL, ENIG, ENEPIG, Immersion Silver, Immersion Stain, Plating Stain, Plating Silver, Electrolytic Nickel Gold, Soft Gold, Hard Gold, Gold Finger, OSP, Carbon Ink.
28 Trattamento superficiale misto GF OSP, GF HASL, OSP ENIG, IAG GF, Isn GF GF OSP, GF HASL, OSP ENIG, IAG GF, Isn GF
29 Routing Tolleranza di routing (laser) ±0.05mm ±0.05mm
30 Tolleranza di routing (CNC) ±0.15mm ± 0,1 mm
31 Altri Metodo di trattamento Attraverso l'apertura della finestra del foro, attraverso l'olio del coperchio del foro, attraverso l'olio del tappo del foro, attraverso la resina del tappo del foro / pasta di rame Attraverso l'apertura della finestra del foro, attraverso l'olio del coperchio del foro, attraverso l'olio del tappo del foro, attraverso la resina del tappo del foro / pasta di rame
32 Warp e Twist ≤0.7% ≤0.5%
33 Impedanza controllata ±10% ±5%
34 Processo speciale Dite d'oro, mezzi fori, bordi in metallo, scanalature a gradini, ecc. Dite d'oro, mezzi fori, bordi in metallo, scanalature a gradini, ecc.