Starting March 1, Japanese semiconductor materials giant Resonac raised prices for copper-clad laminate (CCL) and adhesive films by over 30%. The company stated that, despite implementing various cost-optimization measures, ongoing shortages and price increases in key raw materials such as fiberglass cloth, epoxy resin, and copper foil necessitated this price adjustment to ensure a stable product supply and to support investment in new technology research and development.
As a major global supplier of CCL andcopper-cladd laminate adhesive materials, Resonac’s price increase will affect high-end manufacturing segments such as MLCCs, HDI boards, IC substrates, and high-frequency, high-speed PCBs.
Copper-clad laminate is a core raw material for PCBs, with upgrades to traditional servers and the penetration of AI servers driving both increased volume and higher prices for copper-clad laminates. Copper-clad laminate accounts for approximately 30% of the raw material cost of PCBs. Prismark projects a compound annual growth rate of 5.40% for global PCB production value from 2024 to 2028. The server/memory sector is projected to grow at 13.6%.
El equipo de electrónica de Dongguan Securities cree que, teniendo en cuenta los precios continuamente altos de las materias primas, la alta tasa de utilización general de los PCB aguas abajo, el desplazamiento de la capacidad convencional por los productos de laminado revestido de cobre (CCL) de IA y la cuota de mercado relativamente concentrada de los fabricantes de CCL, se espera que la tendencia de ajuste de precios para los productos de CCL continúe, y se espera que el rendimiento y la rentabilidad de las empresas relacionadas aumenten constantemente.
On the evening of March 2, Mitsubishi Gas Chemical announced a 30% price increase for CCL starting April 1; previously, Resonac announced a price increase for PCB materials, including copper foil substrates (CCL) and adhesive films, exceeding 30%, effective March 1.
El laminado revestido de cobre (CCL) es una materia prima básica para PCB, que representa aproximadamente el 30% del costo total. Con los sucesivos lanzamientos de plataformas de computación de IA de próxima generación, los requisitos para materiales de alta velocidad y alta frecuencia han aumentado significativamente. Los materiales de transmisión de PCB se están actualizando de los grados M6 y M7 a los grados M8 y M9.
However, only a few companies can mass-produce high-end CCLs. The fact that Japanese companies have taken the lead in raising prices suggests that the supply of high-end products is not abundant and that bargaining power is shifting back to the materials side.
Recently, major global and domestic copper-clad laminate (CCL) manufacturers have collectively issued price increase notices, signaling a significant price surge across the industry. The following is an analysis of the core details, driving factors, and impact of this round of CCL price increases:
- Price Increases by Major Companies
- Mitsubishi Gas Chemical (MGC): Effective April 1, 2026, will increase prices by 30% for all CCL, Prepreg, and CRS product lines.
- Resonac (Japan): Effective March 1, 2026, will increase prices for CCL and adhesive films by over 30%.
- Kingboard Laminates: Effective June 16, 2026, will increase the average price of copper-clad laminate (CCL) and prepreg by 15% (FR-4 (1.3mm and above) by 15%, CEM-1/22F by 10%, PP by 15%), and partially increase copper foil processing fees.
- Other domestic manufacturers: Companies such as Fujian Lihao (which increased prices on some sheets by 5-8 yuan/sheet starting February 25), Jinan Guoji (which raised prices on some sheets starting February 25), and Shengquan Group (which raised prices on some resin products by 15%-20% starting July 13) have also followed suit with price increases.
- Core Drivers of Price Increases
- Significant Increase in Upstream Raw Material Prices: Prices of core raw materials, including fiberglass cloth (electronic cloth), copper foil, and resin, have continued to soar. Furthermore, some materials (such as high-end electronic cloth) are in short supply due to capacity conversion, leading to a significant increase in CCL production costs and heightened cost pressures for companies.
- Structural Explosion in Downstream Demand: The surge in demand for AI computing power (AI servers, high-end switches) has driven strong demand for high-end CCL materials (low-dielectric, low-expansion, high-frequency, and high-speed). Some high-end products are in short supply, increasing overall bargaining power.
- Improved Supply and Demand Structure in the Industry: AI demand has squeezed conventional production capacity, leading to a partial reduction in ordinary CCL production capacity. Overall industry inventory is low, resulting in a tight supply-demand relationship and providing market support for price increases.
III. Industry Impact and Trends
- Corporate Profit Recovery: Price increases help alleviate cost pressures on CCL manufacturers, improving their profitability. Leading companies with high-end product capacity are expected to see a recovery in their performance.
- Increased Industry Concentration: High-end CCL technology has high barriers to entry. The price surge further highlights the bargaining and cost advantages of leading manufacturers, potentially increasing industry concentration.
- Price Transmission Effect: As a core raw material for PCBs (Printed Circuit Boards), CCL price increases will be gradually passed through to PCB and downstream industries such as AI servers, consumer electronics, and automotive electronics, thereby raising the cost of related end products.