We are proud to say that our partner has China’s largest design center, with over 800 experienced engineers providing efficient design services to clients worldwide. They collaborate closely with major integrated circuit companies, drawing on over 20 years of industry design experience. In the face of ever-changing markets and new customer requirements, rapid response and adaptation are essential capabilities.
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A continuación se muestra un resumen de nuestras capacidades de diseño y algunas de nuestras experiencias en proyectos de diseño.
| Artículos | Capacidades |
| Capas de diseño máximas | 78L |
| Número PIN máximo | 150000+ |
| Número máximo de conexiones | 33926 Conexiones |
| Ancho mínimo de traza | 2mil |
| Espacio mínimo de traza | 2mil |
| diámetro mínimo vía | 3mil |
| Número máximo de BGA | 120+ |
| Espaciamiento mínimo del PIN BGA | 0.15mm |
| Número máximo de PIN BGA | 18865pin |
| Velocidad máxima de señal | 224G-PAM4 |
| Procesador | PHYTIUM: FT-5000/2500/2000/1500 Serie D3000 |
| LOONGSON: Serie LOONGSON1/LOONGSON2 /LOONGSON3 | |
| Rockchip: Serie Rk35/33/32/31/30/18 | |
| HISILICON: Serie Hi31/Hi35/Hi37 | |
| ZhaoXin: KX-5000/6000/7000 | |
| Intel: Purley Ivy Bridge and Sandy Bridge Series Whitley Eagle Stream Shark Bay Mobile Platform Birch_Stream Tiger Lake Alder Lake Raptor Lake Meteor Lake Arrow Lake Lunar Lake Panther Lake | |
| AMD: Fp7 Fp8 Milán Génova Bérgamo Turín | |
| Marvell: PXA920/920H Series/3XX/27X Xelerated Series ARMADA1000/1500 98CX8129/8297 | |
| Qualcomm/SPRD/MTK Mobile: SC9610/8810 SC8280/8380/8480X Snapdragon X2 Ultra MT8188/MT8189 MT8195/MT8196 | |
| Serie PowerPC de escala libre: MPC8541 / 8548 / 8555 / 8641 P2020 | |
| TI: AM35X / 38X / 335X / 437X / 5K2EX / P3505 OMAP4430 66AK2EX / AK2HX C667X | |
| FPGA y CPLD | AMD Xilinx: Spartan-6 Spartan-7 FPGA Artix-7 Kintex-7 Virtex-7 Virtex5 Zynq-7 Virtex-ultrascale XCVU7P/XCVU9P/XCVU11P/ XCVU13P/XCVU15P/XCVU19P Versal AMD Versal Series |
| Intel/Altera: Serie Stratix (S10) Serie Arria (A10) Serie Cyclone Serie MAX 1SG280 Nf43 | |
| Cavio: CN106XXX CN9XXX CN8XXX CN7XXX CN6XXX CN50XX NITROX III NITROX PX | |
| Lattice: Serie MachX03 Serie MachX02 Serie LatticeECP3 Serie iCE40 | |
| Módulo de alimentación y chip | TI: TPS62XXX/65XXX TPS75XXX/82XXX TPS54XXX/40XXX LM51XXX/50XXX PTH0XXX BQ25XXX/24XXX |
| Lineal: LTM46XX/80XX | |
| Máxima: MAX8698/8903A | |
| Intel: EM2140P01QI EM2260xQI EM2280xQI | |
| Renesas: ISL91302B ISL91301A ISL91301B ISL99140 ISL99227 | |
| MPS: MPM26XX/35XX MPM36XX/38XX MPM54XX MEZD41XXX MPQ86XXX | |
| Infineon: TDA21XXX TDA38XXX TDM22545D TLF12505 | |
| Chip de interfaz de conversión | Broadcom: BCM78900/78910 BCM56334/56331/56960/56980/56990 BCM84793/8129/88370/88470…… |
| ADI: AD5767/4001/9776/9779 AD9788/8370/8012 ADE9000 ADAQ7980/7988 | |
| TI: ADS8860/8861/54J60 ADC32RF45/3244/8775 ADC39J84/80004 DAC5681/DAC3282 | |
| Marvell: 88E6083/1111/8070/8059 88DE2750 | |
| PMC: PM5440/5990/80XX | |
| ClariPhy: Cl20010 | |
| Nephos: Np8579/NP8369/NPS400 | |
| Chip de memoria | Samsung: DDR5 DDR4 DDR3 GDDR5/6/7 LPDDR4/4X LPDDR5/5X |
| Hynix: DDR5 DDR4 DDR3 DDR2 GDDR5/6/7 LPDDR4/4X LPDDR5/5X | |
| Mircon: DDR5 DDR4 DDR3 GDDR5/6/7 LPDDR4/4X LPDDR5/5X | |
| CXMT: DDR5 DDR4 DDR3 LPDDR4/4X LPDDR5 |
