We are proud to say that our partner has China’s largest design center, with over 800 experienced engineers providing efficient design services to clients worldwide. They collaborate closely with major integrated circuit companies, drawing on over 20 years of industry design experience. In the face of ever-changing markets and new customer requirements, rapid response and adaptation are essential capabilities.
Android, Linux, WinCE, Ubuntu, Debian, desenvolvimento integrado no plano BSP.
SDRAM, DDR2, DDR3, LPDDR3, DDR4, LPDDR4, eMMC, NAND FLASH, SPI FLASH, QSPI FLASH, EEPROM, SRAM, SSD, hard drive, USB flash drive.
UART, I2C, SPI, CAN, LIN, Ethernet, USB 2.0, USB 3.0, Type-C, SDIO, PCI Express (PCIe), SATA, SerDes, comunicação sem fio, ônibus periférico
HDMI, DVI, VGA, LVDS, MIPI, DSI, DisplayPort (DP), CVBS, EDP, SDI, toque capacitivo e toque resistente.
NXP, Rockchip, Allwinner, Texas Instruments
Xilinx, Nvidia, Intel, Horizon Robotics
