We are proud to say that our partner has China’s largest design center, with over 800 experienced engineers providing efficient design services to clients worldwide. They collaborate closely with major integrated circuit companies, drawing on over 20 years of industry design experience. In the face of ever-changing markets and new customer requirements, rapid response and adaptation are essential capabilities.
Sviluppo integrato a livello di scheda Android, Linux, WinCE, Ubuntu, Debian, BSP.
SDRAM, DDR2, DDR3, LPDDR3, DDR4, LPDDR4, eMMC, NAND FLASH, SPI FLASH, QSPI FLASH, EEPROM, SRAM, SSD, disco rigido, unità flash USB.
UART, I2C, SPI, CAN, LIN, Ethernet, USB 2.0, USB 3.0, Type-C, SDIO, PCI Express (PCIe), SATA, SerDes, comunicazione wireless, bus periferico
HDMI, DVI, VGA, LVDS, MIPI, DSI, DisplayPort (DP), CVBS, EDP, SDI, tocco capacitivo e tocco resistivo.
NXP, Rockchip, Allwinner, Texas Instruments
Xilinx, Nvidia, Intel, Horizon Robotics
