We are proud to say that our partner has China’s largest design center, with over 800 experienced engineers providing efficient design services to clients worldwide. They collaborate closely with major integrated circuit companies, drawing on over 20 years of industry design experience. In the face of ever-changing markets and new customer requirements, rapid response and adaptation are essential capabilities.
Développement intégré au niveau de la carte Android, Linux, WinCE, Ubuntu, Debian, BSP.
SDRAM, DDR2, DDR3, LPDDR3, DDR4, LPDDR4, eMMC, NAND FLASH, SPI FLASH, QSPI FLASH, EEPROM, SRAM, SSD, disque dur, lecteur flash USB.
UART, I2C, SPI, CAN, LIN, Ethernet, USB 2.0, USB 3.0, Type-C, SDIO, PCI Express (PCIe), SATA, SerDes, communication sans fil, bus périphérique
HDMI, DVI, VGA, LVDS, MIPI, DSI, DisplayPort (DP), CVBS, EDP, SDI, tactile capacitif et tactile résistif.
NXP, Rockchip, Allwinner et Texas Instruments
Xilinx, Nvidia, Intel, Horizon Robotics
