We have 60+ SMT production lines, equipped with new Fuji NXTIII, AIMEX, XPF full-automatic solder paste printing machines, 15-temperature zone lead-free nitrogen reflux furnaces, wave soldering and other high-end equipment, AOI, 3D SPI, 3D X-RAY, intelligent first article testers, full-automatic plate splitters, crimping machines, BGA rework stations, and three-proofing paint. Our focus is on high-quality R&D for proofing, small-, medium-, and large-scale SMT processing, assembly, and other services.
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The following lists the basic SMT processing capabilities of our partners.
| Project | Conventional technology | Unconventional technology | Remarks | ||
| SMT process | PCB | Minimum size | L≥50mm W≥50mm | L<50mm W<50mm | The distance between BOT, TOP surface components, and Markpoints and the edge of the board shall be 3 mm; |
| Maximum size | L≥50mm W≥50mm | L≤600mm W≤450mm | |||
| Component thickness (t) | 0.5mm≤T≤3mm | T<0.5mm, T>3mm | The size of unconventional PCB is within the scope of semi-automatic printing equipment, and the minimum accuracy is 0.5 Pitch | ||
| Device size | Minimum package | 0201(0.6mm*0.3mm) | 01005(0.3mm*0.2mm) | Height of double-sided process device: 25mm. | |
| Maximum size | SMD≤200mm*125mm | SMD>200mm*125mm | |||
| Device thickness | T≤15mm | T>15mm | |||
| QFP, SOP, SOJ and other polyPODs. | Minimum PiN spacing | 0.35mm | 0.3mm≤Pitch<0.35mm | ||
| CSP BGA | Minimum ball spacing | 0.35mm | 0.3mm≤Pitch<0.35mm | ||
| DIP process (wave soldering) | PCB size | Minimum size | L≥50mm W≥50mm | L<50mm | 1. BOT surface element < 5 mm; 2. The distance between the pin of the plug-in component and the SMT part on the BOT surface > the thickness of the SMT part + 2.0mm. |
| Maximum size | L≤500mm W≤400mm | L<800mm W≤400mm | |||
| Thinnest size | 0.5mm | T<0.5mm | |||
| Thickest size | 5mm | T>5mm | |||
| DlP process (wave soldering) | Processing parameter | Temperature tolerance range | -30°C≤T≤120°C | -50°C≤T≤150℃ | |
| Coating thickness | 20um≤T≤50um | T>50um | |||
| Flying needle testing process | Device height | upside | H≤60mm | H>60mm | |
| downside | H≤120mm | H>120mm | |||
| PCB thickness | thickness | T≤5mm | T>5mm | ||
